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Take your IP management to the next level on a collaborative and comprehensive platform empowering IP reuse, integrated with requirements and test traceability, issue & defect management, virtual testing and advanced analytics. Discover how collaboration between OEMs and chipmakers leverage built-in security and full traceability to accelerate innovation from specifications to validation, manufacturing and integration.
Discover innovative, advanced simulation capabilities for developing innovative chips and systems. Discover our market-leading, multi-scale and multi-physics simulation technology, fully integrated on the 3DEXPERIENCE platform for semiconductor innovation. Accelerate and de-risk your innovation through simulation from molecular designs of semiconductor materials, to the chip, to the package, and finally to the electronic board.