Thermal & EMC Co-Simulation on the 3DEXPERIENCE Platform

Electromagnetic compatibility (EMC) and electronics cooling pose different and often contradictory challenges for engineers. EMC often requires shielding to reduce radiated emissions and interference, while cooling requires vents and openings that allow airflow over high-power components. Simulation helps engineers to understand potential EMC and thermal risks to the design and to find trade-offs that help mitigate both issues.

Highlights

• Simulate both radiated emissions/interference and thermal performance in the same tool.
• Build accurate surrogate models of electronics cooling systems.
• Use design of experiments (DoE) to find the best trade-offs between shielding and cooling