Manage solder fatigue and thermal performance in semiconductor packaging.
Watch this replay that focuses on managing solder fatigue and thermal performance in semiconductor packaging using advanced Abaqus techniques.
We’ll cover essential topics like handling thermal expansion mismatches, understanding cyclic loading impacts, and applying damage models for lead-free solder and thermal interface materials (TIM). You’ll also learn how to use direct cyclic procedures to reach stabilized responses faster, helping you optimize solder durability and improve thermal management in chip designs.
