Smarter Packaging Design for High Tech: Virtual Testing for Reliability and Sustainability

In the high tech industry, packaging plays a critical role in protecting sensitive products while ensuring compliance, sustainability, and global logistics performance. Devices and components must withstand mechanical shocks, vibration, thermal variation, and long supply chains—all without driving up cost or delaying product launches. To meet these challenges, companies are increasingly turning to virtual testing to accelerate packaging development and validation.

This replay explores how modeling and simulation (MODSIM) can be applied to build accurate virtual twins of high tech packaging to predict performance under real-world conditions. By reducing reliance on iterative physical testing, manufacturers can ensure reliability, accelerate design cycles, and make better-informed decisions earlier in the process.

Key topics will include:

• Drop, vibration, and thermal simulations to evaluate packaging reliability across global shipping environments
• Secondary and tertiary packaging simulations to ensure system-level protection
• Democratized simulation for collaboration across design, engineering, and supply chain teams
• Machine-learning driven product improvement by introducing faster design evaluations
• Integrating Life Cycle Assessment (LCA) to align with sustainability and regulatory goals

Attendees will gain insights into how virtual testing strengthens packaging reliability, lowers costs, and shortens time to market.