Accelerating Semiconductor Innovation in India: From silicon to systems

India’s semiconductor mission is moving from investment to execution, with new fabs, new OSAT facilities, & a fast-growing design ecosystem. Our semiconductor opportunity extends beyond manufacturing volume. The next phase is about building connected capabilities, from materials & equipment to chips, packaging, electronic modules, subsystems, and complete systems.

The winners in this next phase won’t be the ones with the most tools. They’ll be the ones with the most connected ones.

Here’s how Dassault Systèmes maps to the semiconductor value chain. The 3DEXPERIENCE platform connects design, simulation, manufacturing, and collaboration, and is trusted by 17 of the top 20 global semiconductor companies. It spans materials & process innovation, IC and chip design, IP management, fab operations, packaging, test and systems integration.

WHAT YOU’LL EXPERIENCE AT OUR BOOTH (Hall 1 | Booth 1638)

• ​​​​​​​​​​Live 3DEXPERIENCE platform demos for chip-to-system collaboration
• Virtual Twin walkthroughs of fab & cleanroom operations
• India-specific use cases across design, ATMP/OSAT & fab-equipment ecosystems, including SECS/GEM
• 1:1 conversation with semiconductor SMEs on your roadmap, bottlenecks, & questions
• Insights on scaling from pilot line to high-volume manufacturing

MEET THE EXPERTS

Our Subject Matter Experts will be at SEMICON India 2026 to discuss IC design, IP management, fab digitalization, & workforce readiness.

Limited 1:1 slot available each day. Register to book a meeting.