SEMICON West 2026 Booth #5240

How can semiconductor manufacturers optimize HBM for the next generation of AI Factories before a single wafer is built? Visit the Dassault Systèmes booth at SEMICON West 2026 to see how Virtual Twins and System-Level Co-Optimization (STCO) unify design, simulation, and manufacturing to accelerate time-to-qualified-yield, improve first-pass success, and deliver more reliable, energy-efficient AI infrastructure.

Join our session Smart Manufacturing of HBM for AI Factories: A Virtual Twin Approach at SEMICON West 2026 and stop by Booth #5240!

HBM has become the bottleneck of the AI era, constraining performance, power efficiency, and scalability more than the GPUs it serves. This session presents a virtual twin–driven STCO methodology for predictive, multi-physics optimization of HBM from design through manufacturing—combining SI/PI simulation (SIMULIA CST Studio Suite), thermo-mechanical analysis (SIMULIA Abaqus), AI-driven surrogate modeling, and process orchestration (Process Composer, Isight) on the 3DEXPERIENCE platform. Early results show a 20–30% reduction in time-to-qualified-yield, 15–25% higher first-pass design success, and up to 40% fewer thermal-induced failures.

Session Details:

• Date: October 13, 2026
• Time: 12:05 PM – 12:25 PM  PST
• Location: Moscone Center, South Hall, Upper Mezzanine, Room 156
• Speakers:
  Apra PANDEY - Director, SIMULIA Industry Process Consultant
  Ashwani GOEL - Global High Tech Industry Process Senior Specialist

Hope to see you there!