From Chips to Intelligence: Next Generation Innovation Powered by Virtual Twins.
Join Dassault Systèmes at SEMICON Europa 2026 and discover how science-based virtual twins help semiconductor and electronics innovators manage complexity from chip to system and from lab to fab.
Explore how the 3DEXPERIENCE platform connects model-based systems engineering, semiconductor IP, EDA context, multiphysics and multiscale simulation, advanced packaging, materials engineering and virtual companions to accelerate and validate engineering decisions.
Join our poster sessions and demos to discover how virtual twins can de-risk fabs, equipment and AI infrastructure before physical deployment, and how models, simulation evidence and engineering knowledge become reusable enterprise assets.