Discover how Dassault Systèmes virtual twins and MODSIM technology optimize packaging systems across all configurations. Learn to accelerate testing, cut costs, and create smarter, sustainable design.
Are casepacks and pallet configurations a costly afterthought? What if you could optimize all packaging touchpoints to save time and money?
Dassault Systemes (DS) will demonstrate how smart virtual twins can provide recommendations to optimize packaging systems – across primary, secondary and tertiary configurations.
By using unified modeling and simulation (MODSIM), packaging engineers and manufacturers can develop virtual twins to predict how your packaging will behave in the physical world. This holds true for primary, secondary and tertiary packaging. This complementary ‘virtual + real’ approach can qualify the primary package and maintain that digital thread so the creation of case packs and pallet configurations can be automated. This increases confidence levels in packaging designs and secures launch windows while lowering costs.
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