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Moisture Diffusion and Swelling in Chip Packages

Live | English | 1h

Discover how to capture moisture diffusion kinetics in PCBs with SIMULIA’s Abaqus solution

Our Speaker

  • Hicham FARID > Speaker > Dassault Systèmes®
    Hicham FARID
    SIMULIA Industry Process Consultant - Dassault Systèmes
    Dr. Hicham FARID has a PhD in Mechanical Engineering from the University of Quebec, Canada, where his research focused on Fracture Mechanics. His primary interests are material…
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