Moisture Diffusion and Swelling in Chip Packages

Printed circuit boards (PCBs) are the fundamental component for almost all electronic products. When PCBs are exposed to humid, ambient conditions, moisture absorption occurs. This results in issues, such as swelling induced failure and signal performance degradation that compromise device reliability. To avoid these challenges, it is crucial for manufacturers and suppliers to understand the kinetics of moisture diffusion in PCBs.
 

Hear Dr. Hicham FARID, a Dassault Systèmes SIMULIA Industry Process Consultant, discuss SIMULIA’s Abaqus solution and how it can capture moisture diffusion kinetics in PCBs.

Highlights:

• Overview of Abaqus Mass Diffusion capabilities
• Reducing the risk of PCB redesign through a better understanding of moisture diffusion kinetics
• Coupled Mass-Diffusion-Structural analysis in Abaqus to capture the moisture induced swelling in PCBs