Manufacturing Process for Chip Packages

Manufacturing simulations are vital in semiconductor packaging, enabling optimization and defect predictions before physical prototyping. As the complexity of the packages increase, these simulations becomes crucial for maintaining quality and improving yield.

This replay explores Dassault Systèmes SIMULIA’s advanced simulation capabilities for semiconductor manufacturing processes including:

• Modeling Thermal Interface Material behavior
• Modeling the Chemical Mechanical Planarization process
• Epoxy underfill simulations
• Solder Re-flow simulations
• Adhesive curing simulations