Join us to see how design and simulation teams are cutting prep time, reducing errors, and getting to insight faster.
Getting chip and package design data ready for simulation shouldn't be the slowest part of the process. Yet for many semiconductor and data center hardware teams, moving from ECAD design tools into MCAD design and analysis tools still means hours of manual geometry cleanup — time that could go toward actual analysis.
This webinar shows a faster path from ECAD to MCAD: a streamlined workflow that gets chip, package, and PCB geometry simulation-ready for both electromagnetic analysis in CST and structural/thermal analysis in Abaqus — with far less manual rework.
Join us to see how design and simulation teams are cutting prep time, reducing errors, and getting to insight faster.
