Curing Analysis of Adhesives For Consumer Electronics

Curing processes are essential to the manufacturing of consumer products that use thermosetting polymers (such as epoxy resins) to bond components. The use of epoxies and other cured structural adhesives is common in many industries. The curing reaction can induce chemical shrinkage strains and residual stresses, which can result in damage to the adherents or warpage of the bonded assembly.

​​​​​​​In this webinar, we will review the following key objectives related to Curing: 

• Abaqus cure modeling capability
• Coupled multiphysics solver
• Adhesive curing
• Curing of composites - Multiscale
• Prediction of residual stress and warpage