Discover a unified SIMULIA multiphysics workflow using CST, Abaqus, and Wave6 to improve electronics and semiconductor design through cross-domain co-simulation.
Modern electronic systems and semiconductor manufacturing equipment increasingly rely on tightly coupled electromagnetic, electrostatic, structural, thermal, and acoustic interactions. This webinar presents a unified multiphysics workflow using SIMULIA CST Studio Suite, Abaqus, and Wave6 to address these challenges through cross-domain co-simulation.
Three representative application examples will be presented: MEMS sensor modeling, electromagnetic-induced PCB vibration and acoustic noise in capacitors, power inductors, and power distribution networks (PDNs), and electrostatic chuck (ESC) switch-on analysis for semiconductor manufacturing. These examples demonstrate how electromagnetic, electrostatic, thermal, structural, and acoustic simulations can be integrated to predict device performance, vibration, and reliability.
The webinar will also introduce CST–Abaqus coupling workflows, including CSTStudioReader for selected multiphysics applications and general External Field transfer for importing CST simulation results—such as forces, temperature fields, power losses, pressure, and other field quantities—into Abaqus. In addition, volume fraction field generation will be demonstrated to simplify complex ECAD-to-MCAD model preparation for structural simulation.
Participants will gain practical insight into integrated SIMULIA workflows that reduce design iterations, improve simulation fidelity, and accelerate product development across electronics and semiconductor applications.
