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BIM World 2022
Integration of the 3DEXPERIENCE platform into ESTP programs
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3DS
Integration of the 3DEXPERIENCE platform into ESTP programs
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April 5 2022 - 9:00 am - 12:00 pm
Booth E40/F41
More information coming soon.
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Speakers
Joel CUNY
General Manager
ESTP Paris