Chicago, IL | USA
Join our experts at the American Packaging Summit 2025 and visit Booth #18
Dassault Systèmes is proud to sponsor The American Packaging Summit (APS) 2025 and share how we’re shaping the future of packaging through Virtual Twin Technology and cutting-edge lifecycle management solutions.
APS is your chance to join 150+ industry leaders as we explore strategies driving innovation, growth, and sustainability in packaging. Held on May 13–14 at the Marriott Chicago O’Hare, this premier event brings together packaging experts across sectors such as food & beverage, pharma, consumer goods, and more.
Don’t miss Ray Wodar’s presentation, "The Decade to Deliver: An Actionable Sustainable Packaging Roadmap", on May 13 at 5:10 PM. Learn how to overcome hurdles in sustainability, leverage lifecycle assessment tools, and implement scalable strategies for circular packaging models.
Why Attend?
Visit us at Booth #18 to discover how Virtual Twin Technology transforms packaging design, accelerates time-to-market, and achieves measurable sustainability.
📅 Save your spot today and start building the future of packaging innovation!
The Decade to Deliver: An Actionable Sustainable Packaging Roadmap
In the “decade to deliver”, manufacturers urgently need to make real progress on a sustainable packaging approach that will support a circular economic model. will provide a roadmap of how to use technology to accelerate sustainable and profitable packaging models, and how to get started immediately.