Structural Fatigue Analysis of Semiconductor Packaging

Semiconductor packaging performance and reliability face many challenges due to modern industry trends, such as environmental compliance and shrinking product size. Virtual testing through advanced realistic simulation offers product developers deeper insight on how final packages will behave, before performing very complex and time consuming testing. This results in a high level of compliance with considerable savings in both time and resources.
 
In this webinar, we will talk about thermal cyclic fatigue of semiconductor packaging using Abaqus. The workflow will be focused on the lead-free solder balls behavior following these main points:

• Transient time dependent analysis approach: establishing the stabilized cyclic behavior
• Direct cyclic approach: Using Fourier series to determine the stabilized cycle
• Low cycle thermal fatigue: Damage initiation and evolution in the solder balls
• Damage modeling in the underfill material