Biography:
Prathap Valale PRASANNAKUMAR is an antenna engineer in the Reality Labs at Meta Platforms, Inc. He has worked on Oculus Quest 2 VR devices. His current research is focused on Wi-Fi (2.4 GHz, 5 GHz, and 6 GHz), Bluetooth, and UWB antennas and improving the isolation between collocated antennas in AR/VR consumer electronics devices. His Ph.D. thesis focuses on the design of monostatic, quasi-monostatic, and bistatic simultaneous transmit and receive (STAR) or In-Band Full-Duplex (IBFD) antenna systems and wideband isolation enhancement techniques. He has over 7.5 years of experience in numerical EM simulations – Method of Moments (MoM), Finite Element (FEM), Time-domain (FIT), hybrid solvers, and other 2D and 2.5D solvers. Dr. Prathap received his MS and Ph.D. degrees in electrical engineering from the University of Colorado, Boulder. Previously he has worked as a deputy engineer in Bharat Electronics, India.
Title:
Designing Virtual Reality Antennas using CST Bio-Modeling
Abstract:
The following presentation demonstrates the role of Computational Electromagnetic (CEM) in consumer electronics design, specifically AR/VR. Simulation of these devices during the initial exploration stages is crucial to understanding the pros and cons of antenna locations and their proximity to various sub-systems. The desired polarization and radiation patterns envelope are key deciding parameters, along with S11 and isolation. Hence, these simulated data with and without human phantom are beneficial for architecture reviews when the prototype and field data are unavailable and (or) hard to collect. This presentation demonstrates the role of virtual human phantoms and the various challenges affecting antenna performance based on antenna placement, body positioning, multi-antenna coupling, and operating environment in the Wi-Fi frequency band. We will also highlight the process of obtaining accurate and efficient simulation results by leveraging SIMULIA CST Studio Suite technology for AR/VR simulation needs.
Biography:
John SANDERS is currently an Assistant Professor of Mechanical Engineering at California State University, Fullerton. He received his Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign.
Title:
Quantifying Crack-tip Stress Concentrations in High-temperature Superalloys using Abaqus Unified FEA with a UMAT User-defined Material Subroutine
Abstract:
Next-generation nuclear reactors are currently being designed to operate at temperatures up to 1000 degrees centigrade. At such high temperatures, metals undergo a combination of elastic and creep deformation, and the primary failure mechanism for next-generation reactor components is expected to be creep rupture. Of particular interest to structural engineers designing such components is the magnitude of the stress concentration ahead of a crack tip in creeping metals - a classical problem in continuum fracture mechanics, but one that is impossible to treat analytically for all but the simplest material models. This talk will present recent finite element simulations of the crack-tip stress fields performed using the Abaqus Unified FEA product suite. To investigate the behavior of the stress concentration during the transition from the primary creep phase to the secondary creep phase, a unified creep-plasticity model developed by researchers at Oak Ridge National Laboratory, and calibrated to experimental data for two high-temperature superalloys, was implemented via a UMAT user-defined material subroutine. The simulations reveal not only the relevant loading parameters that characterize the crack-tip stress concentration, but also a dimensionless number quantifying the influence of primary creep on the crack-tip stress fields. These results promise to aid in the design of next-generation nuclear reactor components.
Biography:
Dinesh has over 17 years of professional experience in engineering analysis and simulation in High Tech, Aerospace and Medical devices industries. He is a Director, Industry Process Consultants at Dassault Systèmes SIMULIA Cop focusing on technical sales and advanced simulation methods development. Dinesh received his MS and Ph. D in Engineering Mechanics from Case Western Reserve University. He graduated with a B. Tech in Civil Engineering from the Indian Institute of Technology Madras, India.
Title:
Semiconductors Packaging Performance and Reliability
Biography:
David NAJERA is a project engineer at ATA Engineering in San Diego. His work is focused on material characterization and nonlinear dynamics.
Title:
Integration of Abaqus with Open Source Tools for Material Characterization of Metallic Additively Manufactured Parts
Abstract:
Cost-effective and rapid implementation of additive manufacturing (AM) for complex parts in critical applications is currently impeded by a lack of predictive insights into the physics of AM processes and their impact on part performance and reliability. To address this challenge, a complete thermal mechanical-material modeling and simulation workflow was developed that uses automated data mapping and translation tools to integrate part-level print simulations, probabilistic grain growth models, and crystal plasticity homogenization techniques to efficiently predict metallic part residual stresses, net shape, and strength. Thermal-mechanical fields during printing are simulated using the finite element analysis code Abaqus. The as-printed grain microstructure is predicted from Abaqus thermal history results using the kinetic Monte Carlo code SPPARKS. The homogenized microstructural response is determined with the crystal plasticity spectral solver DAMASK. Dimensionality reduction is performed by employing a K-means algorithm to cluster regions of similar thermal histories in a part for spatially varying assignment of mechanical properties. Finally, process simulation insights (residual stresses, material properties) are embodied in a part-level Abaqus finite element model representing the as-built condition. This workflow has been demonstrated and partially validated via prediction of the tensile response of two sets of 316L cylindrical test coupons with varying printing paths and manufactured with a directed energy deposition process, which were presented in Yadollahi et al. [Materials Science and Engineering: A 664, 2015: 171–83]. The results show a path toward a foundational physics-based simulation toolset for part performance characterization that leverages state-of-the-art tools available to industry.
Biography:
Jaewon KIM received B.S. and M.S. degrees in Electronics Engineering from Korea University, South Korea, in 2001 and a Ph.D. degree in Electrical Engineering from the University of Minnesota, Minneapolis, MN, in 2008. Since 2008, his research area includes electromagnetics and metamaterials at 3M Corp. Research Lab in St. Paul, MN; current project is working on 5G/mmWave material developments. His publication at 3M includes 139 IS submissions and 45 patents filed.
Title:
3M 5G/mmWave Material Research: How to deal with reflection issues?
Abstract:
As the operation frequency increases for 5G/mmWave communication, new challenging issues becomes raised. As an RF engineer, I can see new challenges with 5G/mmWave applications. One of new challenges is the unwanted reflection from dielectric objects which start causing significant issues on the signal transmission because the thickness of dielectric objects and materials is getting close to the wavelength of the signal. The wavelength is about 10mm in air at 28GHz and the wavelength is about 3mm in air at 110GHz. We will discuss about these challenging problems and the solutions.
Biography:
Satheesh is an Industry Process Expert Director responsible for Home & Lifestyle and Transportation & Mobility Propulsion. He has 20 years of experience in vehicle development: thermal management and aerodynamics. He is currently responsible for deploying digital solutions for electric and conventional propulsion systems. He has strong experience in promoting PowerFLOW solutions with automotive OEM’s around the globe, including Nissan, Toyota, Tesla, General Motors, and Ford Motor Co. Satheesh has led the development of the Denso engine cooling module library in PowerFLOW. This tool was the first of its kind where it embedded a supplier’s intellectual property in a CAE tool. Satheesh is currently focusing on developing seamless, accurate, robust digital solutions for developing vehicle propulsion and battery systems powered by Dassault Systèmes’ cutting-edge Modeling and Simulation offerings. Satheesh has a graduate degree from Oklahoma State University, Stillwater, OK, and an undergraduate degree from the Indian Institute of Technology, Bombay, India.
Title:
Accelerate an Electric Drive Development Process through Connected Modeling and Simulation
Abstract:
An overview on Dassault Systèmes’ cutting edge offering to empower the design of electric drives. Electric drive development poses different challenges compared to the ones faced by the internal combustion engine. Electric machines are geometrically simpler, but their performance is impacted by multiphysics interactions. Dassault Systèmes’ offering for electric drive design is powered by a modular, parametric, customizable solution that connects design and engineering. It can be leveraged by experts and non-experts to design, evaluate and optimize the electric drives to meet today’s challenges such as the optimal use of rare earth material, consolidation of vehicle platforms and re-use of electric drives across vehicle model variants.
Biography:
Prashant ANDRADE is a Mechanical Simulation Engineer at Waymo since October 2018 where he works in the hardware team on the analysis and design of sensors used by the Waymo Driver. Prashant primarily deals with shock, vibration and nonlinear mechanics problems. Prior to Waymo, Prashant worked in the Special Projects and iPhone groups at Apple in Cupertino. Prashant has also worked at Dassault Systèmes both in Michigan and California in a variety of roles. Prashant received a Ph.D. from the University of Texas at Austin specializing in structural dynamics.
Title:
Response Spectra Methods
Abstract:
The presentation will survey response spectra techniques commonly used in the aerospace, automotive and other industries. It will start by discussing how simply looking at peak g values of an input loading signal is not the most meaningful way to evaluate the severity of the applied shock excitation. This will be followed by a discussion of the Shock Response Spectrum (SRS) and Vibration Response Spectrum (VRS) and how they are typically generated from input transient signals and Power Spectral Density functions (PSDs) respectively. Intuitive explanations of the SRS, PSDs and VRS will be provided with a minimum of mathematical treatment. Finally, ways of using the response spectra generated to help with preliminary design of structures subjected to mechanical shock and vibration loading will be explored.
Biography:
Mark has been with SIMULIA for over 30 years. Contributing in a variety of sales and technical management roles, he currently leads a global technical sales group supporting advanced applications. He has degrees in structural engineering from Brown University and the University of California, Berkeley.
Title:
SIMULIA Brand Update
Abstract:
Simulation from the SIMULIA brand is absolutely essential to the vision and ambition of Dassault Systèmes. Simulation is a key driver to address the present and future needs of analysts, designers, producers, and consumers. Simulation not only powers product design improvement and cost reduction, but also innovation and sustainability. Hear about the latest in thinking from our brand executive team including recent trends, focus topics, positioning, and ambition.
Biography:
Hicham has a PhD in Mechanical Engineering with research focused on Fracture Mechanics from the University of Quebec, Canada. His major interests are material modeling and calibration, fracture mechanics, plastics and composites, as well as fatigue and creep interaction. Before joining Dassault Systèmes, Hicham spent 12 years working as R&D Engineer/Scientist at different organizations in aerospace, nuclear, and renewable energies. Hicham is passionate about new technology. He loves to take this passion to his customers where he helps them challenge the status quo and navigate new horizons.
Title:
Structures Update
Abstract:
This presentation will focus on recent Abaqus enhancements related to contact, materials, analysis procedures, and high performance computing (HPC). New capabilities for modeling and results visualization will also be discussed.
Biography:
Morris has an engineering degree from MUL Technical University in Austria and a business degree from University of Minnesota. He has contributed as a design verification engineer in Germany and in the US from 1998-2008 and has been working as a CAE software sales manager/director since then. In his current role, Morris leads SIMULIA High-Tech sales team in the US.
Title:
Vibroacoustics Update
Abstract:
This talk will review recent enhancements to wave6 for modeling full spectrum vibro-acoustics. A number of applications will be discussed including new methods for auralization and simulation of infotainment systems.
Biography:
Dr. NAIDU has been with Dassault Systèmes since 2018 as an Industry Process Consultant in the emerging fluids. He holds a PhD in Mechanical Engineering from University of New South Wales, Australia with a focus on “Flapping wing Aerodynamics”. Prior to Dassault, he acquired several years of CFD experience catering to diverse industries such as automotive, life sciences and consumer goods. His main interests and expertise are in Computational Fluid Dynamics, Fluid Structure Interaction and Aerodynamics.
Title:
CATIA V5 Driven MODSIM Process for Fluid Dynamics Engineer Role on the 3DEXPERIENCE platform
Abstract:
Computer-aided Design (CAD) and Computer-Aided Engineering (CAE) technology evolved separately over decades. These independent CAD and simulation tools do not have the architecture to support integrated design and simulation. This has led to sequential and discrete design and simulation processes and it has resulted in inefficient handoffs that frequently occur too late in design between designers and simulation experts.
However, the ability to integrate design and simulation, also known as 'MODSIM', provides design and analysis engineers the advantage of experiencing their design. MODSIM integrates complete CATIA and SIMULIA technologies to provide a common user interface and data model for modeling and simulation with the 3DEXPERIENCE Platform. By applying simulation to the earliest phase of design it’s possible to accurately predict, compare and simulate multiple product behaviors. Insight into product performance is essential to delivering high-quality products that meet requirements. MODSIM has proven to provide shortened product development cycles by minimizing rework, data transfer delay, extensive physical prototyping and testing. In our talk, we will highlight an example of CATIA V5 driven MODSIM process for an automotive HVAC duct using Computation Fluid Dynamics simulation.
Biography:
Jonathan is currently Director of High Tech Industry Enablement at Dassault Systèmes. Previously he has held leadership positions at a high tech Silicon Valley start-up company and at CST where he looked after North American sales prior to its acquisition by Dassault Systèmes in 2016. Jonathan has an engineering background in electronics and electromagnetic simulation and holds a B.Sc. in Electronic Engineering.
Title:
The Future of High Tech and Simulation
Abstract:
High tech products must be innovative, developed rapidly and must meet or exceed end-user expectations. Devices must also meet various global compliance standards across the full range of variants. Here we will take a look at what's driving the high tech market and how simulation and digital twin approaches can accelerate innovation while ensuring KPIs and certifications are met.
Biography:
Originally from Dominican Republic, I have been dealing with FEA on and off for over forty five years, starting with using the UC Berkeley solver SAP-4 on an IBM 360 mainframe in the early 70’s to running Abaqus Standard and Explicit on Linux servers and a Linux desktop in the present day. I received a BS and MS in Civil Engineering from the Illinois Institute of Technology, and a Ph.D. in Civil/Structural (with a minor in Applied Mechanics) from Stanford University. Somewhere along the line, I decided that FEA was more interesting than Civil Engineering; I have pretty much been doing the former full time since 1990. I started using Abaqus in 1995 when I worked at Freudenberg-NOK General Partnership in Manchester, NH, and continued using it when I joined Edwards Lifesciences in 2002. I started using Abaqus Explicit in 1997 after I asked HKS for help in solving a nasty deformable-to-deformable contact problem that was not converging in Standard but ran beautifully in Explicit, despite the analysis dealing with two nearly incompressible materials. I’m the father of four adult children, one millennial stepson, and grandfather of a five month old boy.
Title:
Past and Current Computational Performance of a Numerical Study of a Superelastic Anchoring Stent Embedded in a Hyperelastic Tube (and some “war stories”)
Abstract:
In this presentation, I will:
- Discuss the importance of High Performance Computing (HPC) in the Medical Device industry
- Show an example based on an FEA based radial fatigue simulation of the anchor of a Mitral valve reshaping device
- Compare performance between initial (2009) and more recent (2022) computational hardware
- Discuss “war stories” based on my usage of Abaqus going back to 1995, including the evolution from dual core workstations to multicore Linux servers
- Explain the great value of Abaqus Explicit in running FEA’s with a lot of contact