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Stretchable Electronics and Deterministic 3D Assembly

Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent and deformed into arbitrary shapes.  Inorganic electronic materials in micro/nanostructured forms, intimately integrated with elastomeric substrates offer particularly attractive characteristics in such systems, with realistic pathways to sophisticated embodiments. 

Simulations play a key role in this development by identifying the underlying mechanism and providing analytical solutions to guide design and fabrication. I will present our research on stretchable silicon and its applications to stretchable and foldable circuits, electronic-eye camera, semi-transparent and flexible LED, epidermal electronics, dissolvable electronics, injectable, cellular-scale optoelectronics, and soft, microfluidic assemblies of sensors, circuits and radios.  Review of stretchable electronics has been published.

  • May 15-18 2017 - 1.00 am - 2.00 am